BWCC2KD6-32G ((32GB+32Gb) BWCC2KD6-64G ((64GB+32Gb) BWMA24B-XXGC EMCP IC
BIWIN eMCP Chips BWCC2KD6-32G ((32GB+32Gb) BWCC2KD6-64G ((64GB+32Gb) BWMA24B-XXGC EMCP IC
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Aplikasi:
Mobil / Smartphone
Deskripsi:
Karena kapasitas sistem operasi dan aplikasi ponsel pintar meningkat, terutama dengan meningkatnya popularitas sistem operasi Android,ponsel cerdas memiliki persyaratan kapasitas penyimpanan yang lebih tinggi. eMCP BIWIN didasarkan pada MCP (Multi-Chip Packaging) yang mengintegrasikan chip eMMC dan solusi DRAM bertenaga rendah ke dalam paket IC sekali,efektif menyederhanakan proses manufaktur dan biaya pengembangan produk pelanggan dan memperpendek waktu pengembangan produk mereka, sehingga mempercepat peluncuran produk akhir.
Spesifikasi:
| Antarmuka | eMMC: eMMC 5.0 & eMMC 5.1 |
| LPDDR 2 / LPDDR 3: 32bit | |
| Dimensi | 110,50 × 13,00 mm |
| Max. Bacaan berurutan | EMMC 5.0: 130 MB/s |
| EMMC 5.1: 300 MB/s | |
| Max. Menulis berurutan | EMMC 5.0: 50 MB/s |
| EMMC 5.1: 160 MB/s | |
| Frekuensi | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz |
| Kapasitas | 8 GB + 4 GB / 8 GB + 8 GB |
| 16 GB + 8 Gb / 16 GB + 16 Gb | |
| Tegangan Kerja | eMMC: VCC=3,3 V VCCQ=1,8 V |
| LPDDR 2: VDD1 = 1,8 V, VDD2 = VDDQ = VDDCA = 1,2 V | |
| LPDDR 3: VDD1 = 1,8 V, VDD2 = VDDQ = VDDCA = 1,2 V | |
| Suhu Kerja | -20°C sampai 85°C |
| Platform Verifikasi yang Disetujui | Spreadtrum: 7731E, 9832E, 9820E, SC9850K, SC7731C, SC7731G, SC8825, SC9820, SC9832, SC9832A, SC9832E, SC9850, SC9853, SC9863A... |
| Qualcomm: 8909, APQ8009W, MSM8909W... | |
| MediaTek: MT6580, MT6735, MT6737, MT6739, MT6761, MT6570, MT6570N, MT6572, MT6735... | |
| Kemasan | FBGA162 / FBGA221 |
| Aplikasi | Mobil / Smartphone |
Memori flash yang paling terkait IC:
| BWCMAQB11T08GI |
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| BWEFMI032GN2RJ |
| BWEFMI064GN223 |
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| BWEFMA064GN1KC |
| BWEFMA128GN1KC |
| BWMZAX32H2A-16GI-X |
| BWMZCX32H2A-32GI-X |
| BWMEIX32H2A-48GI-X |
| BWMZCX32H2A-64GI-X |
| BWLGYA002GN6ZA |
| BWLGYA004GN6ZC |
| BWLGYA006GN6EI |
| BWLGYA008GN6ZC |
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